We will show our latest material technologies and products at FAKUMA exhibition (Hall B5 – Stand B5-5219) which runs Oct. 15-19 at Messe Friedrichshafen, Germany.

■Sustainability
・Sustainability at Polyplastics
・LAPEROS^® bG-LCP Introducing Biomass Balanced LCP
・DURACON^® bG-POM for Sustainability
・DURACON^® POM Short cellulose fiber reinforced grades
・DURANEX^® rG-PBT, Recyclate-use Engineering Plastics
・PLASTRON^® LFT Long-Fiber Cellulose-Reinforced Thermoplastic Resin
・CAFBLO^® Cellulose Acetate Resin
・Recyclable PE Monomaterial SUP Enhanced by COC
・TOPAS^® COC Monomaterial Polyolefin Blister
・TOPAS^® COC Enhanced Monomaterial Solutions
・TOPAS^® COC Enhanced Polyolefin Shrink Sleeves
・TOPAS^® COC Metalized Films

■Automotive
・Flame Retardant, Durable PPS and PBT Variations
・Laser Weldable POM, PBT and PPS
・Automotive Connectors PBT for High Voltage and LCP for High-Speed Communication requirements
・Optimal materials for cooling components
・Functional materials for E-Motors
・PPS materials with cell insulating plates and special heat resistance for xEV battery
・Exceptional Thermal Shock Resistance without Impact Modifiers
・Lineup of functional materials for millimeter wave radar
・PBT with extremely high laser transmittance and low warpage
・Thermal Shock and Alkali resistant PBT grade
・Mirrors for Head-Up-Displays

■Communication
・Dk Controlled Materials with Low Df (Base station antenna)
・Low Dust LCP Grade LAPEROS^® LCP E525T E530T (Camera module)
・Low & High Dielectric Constant LAPEROS^® LCP (High frequency communication connector)
・Low Df LAPEROS^® LCP (Low Df film)
・Excellent Flowability & Mechanical Property LAPEROS^® LCP GA110 GA130 (PC fan)
・High Flow & Low Warpage LAPEROS^® LCP (Narrow pitch connector)
・High Conductive LCP_LAPEROS^® LCP E727i and GA725 (Optical transceiver)
・New LCP Grade -LAPEROS^® LH Series
・Excellent dimensional accuracy DURAFIDE^® PPS 8670 series
・Excellent Dimensional Stability & Plating Property – DURAFIDE^® PPS 6165A6

■New Offerings
・DURAST^® Powder -Engineering Plastics-
・SARPEK^® PEK
・Optimized POM for Additive Manufacturing Technologies

■Solution
・Total Technical Support by Polyplastics
・CAE Void Prediction Technology
・CAE Reflow Analysis
・Topological Analysis for Design Optimization
・Control Residual Stress by Visualization Technology
・Polyplastics’ Bonding Technology
・AKI-Lock^®
・New metal-plastic bonding technology to achieve high airtightness
・DURACON^® POM Good Sliding Grade without PFAS

■Medical
・DURACON^® POM “PM Series”
・POC Point-of-Care Diagnostics
・Lab-CD, Biochips and Microfluidic
・Micro-Titer Plates and UV-Cuvettes
・Prefillable Syringes
・Vials and Bottles
・Elastic Gasket in MDI
・Dental Implant Container
・Bone Cement Syringe/ Mixer
・Wearable Insulin Pump

Official website: https://www.fakuma-messe.de/en/